Radio frequency module and communication device

ABSTRACT

A radio frequency module includes a module board, a transmission power amplifier, a first inductance element mounted on a first principal surface and connected to an output terminal of the transmission power amplifier, a reception low-noise amplifier, and a second inductance element mounted on a first principal surface connected to an input terminal of the reception low-noise amplifier. In a plan view of the module board, a conductive member mounted on the first principal surface is disposed between the first inductance element and the second inductance element.

CROSS REFERENCE TO RELATED APPLICATION

This is a continuation application of PCT International Application No,PCT/JP2019/022986 filed on Jun. 10, 2019, designating the United Statesof America, which is based on and claims priority of Japanese PatentApplication No. 2018-111070 filed on Jun. 11, 2018. The entiredisclosures of the above-identified applications, including thespecifications, drawings and claims are incorporated herein by referencein their entirety.

TECHNICAL FIELD

The present disclosure relates to a radio frequency module and acommunication device.

BACKGROUND

In mobile communication apparatuses such as a mobile phone thearrangement configuration of circuit elements included in radiofrequency front-end circuits is becoming complex, particularly withdevelopments in multiband technologies.

Patent Literature 1 discloses a circuit configuration of a transceiver(a transmission and reception circuit) that includes multipletransmitters (transmission paths), multiple receivers (reception paths),and a switchplexer disposed between an antenna and the transmitters andreceivers, for performing carrier aggregation (CA) across multiplecommunication bands (frequency bands). Each of the transmitters hastransmission circuits, a PA (a transmission power amplifier), and outputcircuits, while each of the receivers has reception circuits, an LNA (areception low-noise amplifier), and input circuits. The output circuitsinclude elements such as a transmission filter, an impedance matchingcircuit, and a duplexer, while the input circuits include elements suchas a reception filter, an impedance matching circuit, and a duplexer.This configuration allows CA to be performed with switching operationsof the switchplexer.

CITATION LIST Patent Literature

PTL 1: Japanese Unexamined Patent Application Publication (Translationof PCT Application) No. 2014-522216

SUMMARY Technical Problems

However, if the transceiver (the transmission and reception circuit)disclosed in patent literature 1 is implemented in a single module as acompact front-end circuit in a mobile communication device, atransmitter and a receiver (a reception path) may be located in doseproximity, and accordingly, electromagnetic field coupling may occurbetween inductance components of the output circuits of the transmitter(a transmission path) and inductance components of the input circuits ofthe receiver (the reception path). This poses the following problem.Harmonic components of a high-power radio frequency transmission signalamplified by the PA (the transmission power amplifier), orintermodulation distortion components between this radio frequencytransmission signal and another radio frequency signal, flow into thereceiver (the reception path) via the electromagnetic field coupling,reducing the reception sensitivity of the receiver (the reception path).

The present disclosure is conceived for solving the above problem andhas as an object to provide a radio frequency module and a communicationdevice that prevent deterioration of reception sensitivity.

Solutions

In order to achieve the aforementioned object, a radio frequency moduleaccording to an aspect of the present disclosure includes: a moduleboard including a first principal surface and a second principal surfaceon opposite sides of the module board; a first transmission poweramplifier configured to amplify a radio frequency transmission signal; atransmission output matching circuit connected to an output terminal ofthe first transmission power amplifier; a first reception low-noiseamplifier configured to amplify a radio frequency reception signal; anda reception input matching circuit connected to an input terminal of thefirst reception low-noise amplifier, wherein the transmission outputmatching circuit includes a first inductance element mounted on thefirst principal surface, the reception input matching circuit includes asecond inductance element mounted on the first principal surface, and ina plan view of the module board, a conductive member mounted on thefirst principal surface is disposed between the first inductance elementand the second inductance element.

Advantageous Effects

The present disclosure can provide a radio frequency module and acommunication device that prevent deterioration of receptionsensitivity.

BRIEF DESCRIPTION OF DRAWINGS

These and other advantages and features will become apparent from thefollowing description thereof taken in conjunction with the accompanyingDrawings, by way of non-limiting examples of embodiments disclosedherein.

FIG. 1 is a circuit configuration diagram of a radio frequency moduleaccording to Embodiment 1.

FIG. 2A is a schematic diagram illustrating a plan view configuration ofthe radio frequency module according to Embodiment 1.

FIG. 2B is a schematic diagram illustrating a cross-sectionalconfiguration of the radio frequency module according to Embodiment 1.

FIG. 3A is a schematic diagram illustrating a plan view configuration ofa radio frequency module according to a variation of Embodiment 1.

FIG. 3B is a schematic diagram illustrating a cross-sectionalconfiguration of the radio frequency module according to the variationof Embodiment 1.

FIG. 4 is a diagram for describing a spaced arrangement of a firstinductance element and a third inductance element according toEmbodiment 1.

FIG. 5A is a schematic diagram illustrating a plan view configuration ofa radio frequency module according to Embodiment 2.

FIG. 5B is a schematic diagram illustrating a cross-sectionalconfiguration of the radio frequency module according to Embodiment 2.

FIG. 6 is a schematic diagram illustrating a cross-sectionalconfiguration of a radio frequency module according to Variation 1 ofEmbodiment 2.

FIG. 7A is a schematic diagram illustrating a plan view configuration ofa radio frequency module according to Variation 2 of Embodiment 2.

FIG. 7B is a schematic diagram illustrating a cross-sectionalconfiguration of the radio frequency module according to Variation 2 ofEmbodiment 2.

DESCRIPTION OF EMBODIMENTS

Hereinafter, an exemplary embodiment and working examples of the presentdisclosure will be described in detail with reference to the drawings.It should be noted that each of the subsequently described exemplaryembodiment and working examples shows a generic or a specific example.The numerical values, shapes, materials, elements, the arrangement andconnection of the elements, and others indicated in the followingexemplary embodiment and working examples are mere examples, andtherefore are not intended to limit the present disclosure. Among theelements described in the following exemplary embodiment and workingexamples, elements not recited in any one of the independent claims aredescribed as optional elements. In addition, the sizes of the elementsand the ratio of the sizes illustrated in the drawings are notnecessarily accurate.

It should be noted that, with regard to A, B, and C which are mounted ona board in the subsequent exemplary embodiment, “C is mounted between Aand B in a plan view of the board (or a principal surface of the board)”means that, in a plan view of the board, at least part of the region ofC projected in a plan view of the board overlaps a line connecting anarbitrary point in a region of A projected in a plan view of the boardand an arbitrary point in the region of B projected in a plan view ofthe board.

Embodiment 1 1.1 Circuit Configuration of Radio Frequency Module 1 andCommunication Device 5

FIG. 1 is a circuit configuration diagram of radio frequency module 1according to Embodiment 1. As illustrated in the figure, communicationdevice 5 includes radio frequency module 1, antenna element 2, RF signalprocessing circuit (RFIC) 3, and baseband signal processing circuit(BBIC) 4.

RFIC 3 is an RF signal processing circuit that processes a radiofrequency signal that is to be transmitted or has been received byantenna element 2. Specifically, RFIC 3 performs, by downconversion, andso on, signal processing on a radio frequency reception signal input viaa reception signal path of radio frequency module 1, and outputs thereception signal generated by the signal processing to BBIC 4.Furthermore, RFIC 3 performs, by upconversion, and so on, signalprocessing on a transmission signal input from BBIC 4, and outputs aradio frequency transmission signal generated by the signal processingto a transmission signal path of radio frequency module 1.

BBIC 4 is a circuit that performs signal processing using anintermediate frequency band having a lower frequency than a radiofrequency signal propagated in radio frequency module 1. The signalprocessed by BBIC 4 is, for example, used as an image signal for imagedisplay or as a sound signal for communication via a speaker.

Furthermore, RFIC 3 also functions as a controller that controls theconnection of switches 51, 52, 53, 54, 55, and 56 included in radiofrequency module 1, based on the communication band (frequency band) tobe used, Specifically, RFIC 3 switches the connections of switches 51 to56 included in radio frequency module 1 according to a control signal(not illustrated), It should be noted that the controller may beprovided outside RFIC 3, and may be provided in radio frequency module 1or BBIC 4, for example.

Antenna element 2 is connected to common terminal 100 of radio frequencymodule 1, emits radio frequency signals output from radio frequencymodule 1, and receives radio frequency signals from the outside andoutputs the received radio frequency signals to radio frequency module1.

It should be noted that in communication device 5 according to thisembodiment, antenna element 2 and BBIC 4 are not essential elements.

Next, the detailed configuration of radio frequency module 1 will bedescribed.

As illustrated in FIG. 1, radio frequency module 1 includes commonterminal 100, transmission power amplifiers 11 and 12, receptionlow-noise amplifiers 21 and 22, transmission filters 61T, 62T, 63T, and64T, reception filters 61R, 62R, 63R, and 64R, transmission outputmatching circuit 30, reception input matching circuit 40, matchingcircuits 71, 72, 73, and 74, switches 51, 52, 53, 54, 55, and 56,coupler 80, coupler output terminal 180, Common terminal 100 isconnected to antenna element 2.

Transmission power amplifier 11 is a first transmission power amplifierthat amplifies radio frequency signals of communication band A (a firstcommunication band) and communication band B, both belonging to a firstfrequency band group. Transmission power amplifier 12 is a secondtransmission power amplifier that amplifies radio frequency signals ofcommunication band C (a second communication band) and communicationband D, both belonging to a second frequency band group coveringfrequencies higher than those of the first frequency band group.

Reception low-noise amplifier 21 is a first reception low-noiseamplifier that amplifies, with low noise, radio frequency signals ofcommunication band A and communication band B, Reception low-noiseamplifier 22 is a second reception low-noise amplifier that amplifies,with low noise, radio frequency signals of communication band C andcommunication band D.

Transmission filter 61T is disposed in transmission path AT connectingtransmission power amplifier 11 and common terminal 100, and passesradio frequency transmission signals of the transmission band ofcommunication band A out of radio frequency transmission signalsamplified by transmission power amplifier 11. Transmission filter 62T isdisposed in transmission path BT connecting transmission power amplifier11 and common terminal 100, and passes radio frequency transmissionsignals of the transmission band of communication band B out of radiofrequency transmission signals amplified by transmission power amplifier11. Transmission filter 63T is disposed in transmission path CTconnecting transmission power amplifier 12 and common terminal 100, andpasses radio frequency transmission signals of the transmission band ofcommunication band C out of radio frequency transmission signalsamplified by transmission power amplifier 12. Transmission filter 64T isdisposed in transmission path DT connecting transmission power amplifier12 and common terminal 100, and passes radio frequency transmissionsignals of the transmission band of communication band D out of radiofrequency transmission signals amplified by transmission power amplifier12.

Reception filter 61R is disposed in reception path AR connectingreception low-noise amplifier 21 and common terminal 100, and passesradio frequency reception signals of the reception band of communicationband A out of radio frequency reception signals input from commonterminal 100. Reception filter 62R is disposed in reception path BRconnecting reception low-noise amplifier 21 and common terminal 100, andpasses radio frequency reception signals of the reception band ofcommunication band B out of radio frequency reception signals input fromcommon terminal 100. Reception filter 63R is disposed in reception pathCR connecting reception low-noise amplifier 22 and common terminal 100,and passes radio frequency reception signals of the reception band ofcommunication band C out of radio frequency reception signals input fromcommon terminal 100. Reception filter 64R is disposed in reception pathDR connecting reception low-noise amplifier 22 and common terminal 100,and passes radio frequency reception signals of the reception band ofcommunication band D out of radio frequency reception signals input fromcommon terminal 100.

It should be noted that above transmission filters 61T to 64T andreception filters 61R to 64R may be, but are not limited to, any ofsurface acoustic wave filters, acoustic wave filters that make use ofbulk acoustic waves (BAWs), LC resonant filters, and dielectric filters,for example.

Transmission filter 61T and reception filter 61R constitute duplexer 61which has, as a passband, communication band A. Furthermore,transmission filter 62T and reception filter 62R constitute duplexer 62which has, as a passband, communication band B. In addition,transmission filter 631 and reception filter 63R constitute duplexer 63which has, as a passband, communication band C. Moreover, transmissionfilter 64T and reception filter 64R constitute duplexer 64 which has, asa passband, communication band D.

Transmission output matching circuit 30 includes matching circuits 31and 32, Matching circuit 31 is disposed in a transmission pathconnecting transmission power amplifier 11 and transmission filters 61Tand 62T, and matches the impedance of transmission power amplifier 11and the impedance of transmission filters 61T and 62T. Matching circuit32 is disposed in a transmission path connecting transmission poweramplifier 12 and transmission filters 63T and 641, and matches theimpedance of transmission power amplifier 12 and the impedance oftransmission filters 63T and 64T.

Reception input matching circuit 40 includes matching circuits 41 and42. Matching circuit 41 is disposed in a reception path connectingreception low-noise amplifier 21 and reception filters 61R and 62R, andmatches the impedance of reception low-noise amplifier 21 and theimpedance of reception filters 61R and 62R. Matching circuit 42 isdisposed in a reception path connecting reception low-noise amplifier 22and reception filters 63R and 64R, and matches the impedance ofreception low-noise amplifier 22 and the impedance of reception filters63R and 64R.

Switch 51 is a second switch disposed in a transmission path connectingmatching circuit 31 and transmission filters 61T and 62T, and switchesbetween connecting transmission power amplifier 11 and transmissionfilter 61T and connecting transmission power amplifier 11 andtransmission filter 62T. For example, switch 51 is implemented as asingle pole double throw (SPDT) switch circuit in which the commonterminal is connected to matching circuit 31 while one selectionterminal is connected to transmission filter 61T and the other selectionterminal is connected to transmission filter 62T. Switch 52 is a secondswitch disposed in a transmission path connecting matching circuit 32and transmission filters 63T and 64T, and switches between connectingtransmission power amplifier 12 and transmission filter 63T andconnecting transmission power amplifier 12 and transmission filter 64T.For example, switch 52 is implemented as an SPDT switch circuit in whichthe common terminal is connected to matching circuit 32 while oneselection terminal is connected to transmission filter 63T and the otherselection terminal is connected to transmission filter 64T. Switch 53 isa third switch disposed in a reception path connecting matching circuit41 and reception filters 61R and 62R, and switches between connectingreception low-noise amplifier 21 and reception filter 61R and connectingreception low-noise amplifier 21 and reception filter 62R. For example,switch 53 is implemented as an SPDT switch circuit in which the commonterminal is connected to matching circuit 41 while one selectionterminal is connected to reception filter 61R and the other selectionterminal is connected to reception filter 62R. Switch 54 is a thirdswitch disposed in a reception path connecting matching circuit 42 andreception filters 63R and 64R, and switches between connecting receptionlow-noise amplifier 22 and reception filter 63R and connecting receptionlow-noise amplifier 22 and reception filter 64R. For example, switch 54is implemented as an SPDT switch circuit in which the common terminal isconnected to matching circuit 42 while one selection terminal isconnected to reception filter 63R and the other selection terminal isconnected to reception filter 64R.

Switch 55 is a first switch disposed in a signal path connecting commonterminal 100 with transmission filters 61T to 64T and reception filters61R to 64R. Switch 55 switches among (1) connecting common terminal 100with transmission filter 61T and reception filter 61R, (2) connectingcommon terminal 100 with transmission filter 62T and reception filter62R, (3) connecting common terminal 100 with transmission filter 63T andreception filter 63R, and (4) connecting common terminal 100 withtransmission filter 64T and reception filter 64R. Switch 55 isimplemented as a multi-connection switch circuit capable ofsimultaneously establishing two or more of the above connections (1) to(4).

Matching circuit 71 is disposed in a path connecting switch 55 withtransmission filter 61T and reception filter 61R, and matches theimpedance of antenna element 2 and switch 55 and the impedance oftransmission filter 61T and reception filter 61R. Matching circuit 72 isdisposed in a path connecting switch 55 with transmission filter 62T andreception filter 62R, and matches the impedance of antenna element 2 andswitch 55 and the impedance of transmission filter 62T and receptionfilter 62R. Matching circuit 73 is disposed in a path connecting switch55 with transmission filter 63T and reception filter 63R, and matchesthe impedance of antenna element 2 and switch 55 and the impedance oftransmission filter 63T and reception filter 63R. Matching circuit 74 isdisposed in a path connecting switch 55 with transmission filter 64T andreception filter 64R, and matches the impedance of antenna element 2 andswitch 55 and the impedance of transmission filter 64T and receptionfilter 64R.

Coupler 80 and switch 56 form a circuit that monitors the powerintensity of radio frequency signals transferred between common terminal100 and switch 55, and output the monitored power intensity to, e.g.,RFIC 3 via coupler output terminal 180.

It should be noted that matching circuits 71 to 74, coupler 80, switch56, and coupler output terminal 180 are not essential elements of theradio frequency module according to the present disclosure.

In the configuration of radio frequency module 1 described above,transmission power amplifier 11, matching circuit 31, switch 51, andtransmission filters 61T and 62T form a first transmission circuit thatoutputs radio frequency transmission signals of communication band A andcommunication band B toward common terminal 100, Transmission poweramplifier 12, matching circuit 32, switch 52, and transmission filters63T and 641 form a second transmission circuit that outputs radiofrequency transmission signals of communication band C and communicationband D toward common terminal 100. The first transmission circuit andthe second transmission circuit form a transmission circuit that outputsradio frequency transmission signals of communication bands A to Dtoward common terminal 100.

Reception low-noise amplifier 21, matching circuit 41, switch 53, andreception filters 61R and 62R form a first reception circuit thatreceives input of radio frequency reception signals of communicationband A and communication band B from antenna element 2 via commonterminal 100. Reception low-noise amplifier 22, matching circuit 42,switch 54, and reception filters 63R and 64R form a second receptioncircuit that receives input of radio frequency reception signals ofcommunication band C and communication band D from antenna element 2 viacommon terminal 100. The first reception circuit and the secondreception circuit form a reception circuit that receives input of radiofrequency reception signals of communication bands A to D from commonterminal 100, The above-described circuit configuration enables radiofrequency module 1 according to this embodiment to perform at least oneof simultaneously transmitting, simultaneously receiving, andsimultaneously transmitting and receiving a radio frequency signal ofeither communication band A or communication band B and a radiofrequency signal of either communication band C or communication band D.

It should be noted that, in the radio frequency module according to thepresent disclosure, the transmission circuit and the reception circuitneed not be connected to common terminal 100 via switch 55; and thetransmission circuit and the reception circuit may be connected toantenna element 2 via a different terminal. It should also be noted thatthe circuit configuration of the radio frequency module according to thepresent disclosure may include at least transmission power amplifier 11,matching circuit 31, reception low-noise amplifier 21, and matchingcircuit 41, and need not include switches 51 to 56, transmission filters61T to 64T, and reception filters 61R to 64R. In this case, the systemtransmits and receives radio frequency signals of a single communicationband but does not simultaneously transmit, simultaneously receive, orsimultaneously transmit and receive radio frequency signals of two ormore communication bands.

Here, if the circuit elements of above-described radio frequency module1 are implemented in a single module as a compact front-end circuit,electromagnetic field coupling may occur between, for example,inductance components of transmission output matching circuit 30 andinductance components of reception input matching circuit 40. Then, ifharmonic components of a high-power radio frequency transmission signalamplified by transmission power amplifier 11 or 12, or intermodulationdistortion components between this radio frequency transmission signaland another radio frequency signal, flow into the reception circuit viathe electromagnetic field coupling, the reception sensitivity of thereception circuit deteriorates. As an example, the frequency of aharmonic of a radio frequency transmission signal amplified bytransmission power amplifier 11 may overlap at least part of thereception band of communication band C. As another example, thefrequency of intermodulation distortion between a radio frequencytransmission signal amplified by transmission power amplifier 11 andanother radio frequency signal may overlap at least part of thereception bands of communication bands A to D.

To address this, radio frequency module 1 according to this embodimenthas a configuration that prevents electromagnetic field coupling betweeninductance components of transmission output matching circuit 30 andinductance components of reception input matching circuit 40. Thefollowing will describe the configuration that prevents suchelectromagnetic field coupling in radio frequency module 1 according tothis embodiment.

1.2 Circuit Element Arrangement Configuration of Radio Frequency Module1

FIG. 2A is a schematic diagram illustrating a plan view configuration ofradio frequency module 1 according to Embodiment 1. FIG. 2B is aschematic diagram illustrating a cross-sectional configuration of radiofrequency module 1 according to Embodiment 1, and is specifically across-sectional view along line IIB-IIB in FIG. 2A.

As illustrated in FIGS. 2A and 2B, radio frequency module 1 according tothis embodiment further includes module board 91 and resin member 92, inaddition to the circuit configuration illustrated in FIG. 1.

Module board 91, having principal surface 91 a (a first principalsurface) and principal surface 91 b (a second principal surface) on theopposite sides, is a board on which the transmission circuit and thereception circuit are mounted. Module board 91 may be, for example, alow-temperature co-fired ceramics (LTCC) board having a stackedstructure of dielectric layers, or a printed circuit board.

Resin member 92 is disposed on principal surface 91 a of module board 91to cover the transmission circuit, the reception circuit, and principalsurface 91 a of module board 91. Resin member 92 has a function ofensuring the reliability, such as the mechanical strength and themoisture resistance, of the circuit elements of the transmission circuitand the reception circuit. It should be noted that resin member 92 isnot an essential element of the radio frequency module according to thepresent disclosure.

As illustrated in FIGS. 2A and 2B, in radio frequency module 1 accordingto this embodiment, transmission power amplifiers 11 and 12, receptionlow-noise amplifiers 21 and 22, duplexers 61 to 64, matching circuits31, 32, 41, and 42, and switches 51, 52, and 55 are surface-mounted onprincipal surface 91 a of module board 91. It should be noted that,although not illustrated in FIGS. 2A and 2B, switches 53, 54, and 56,matching circuits 71 to 74, and coupler 80 may be surface-mounted oneither principal surface 91 a or 91 b of module board 91 or may beembedded in module board 91.

Matching circuits 31, 32, 41, and 42 are mounted on principal surface 91a of module board 91. Matching circuit 31 includes inductor 31L andcapacitor 31C. Matching circuit 32 includes inductor 32L and capacitor32C. Matching circuit 41 includes inductor 41L and capacitor 41C.Matching circuit 42 includes inductor 42L and capacitor 42C. Inductors31L and 32L are each a first inductance element in transmission outputmatching circuit 30 and implemented, for example, as a chip inductor oras a wiring pattern formed on principal surface 91 a, Inductors 41L and42L are each a second inductance element in reception input matchingcircuit 40 and implemented, for example, as a chip inductor or as awiring pattern formed on principal surface 91 a.

Here, in radio frequency module 1 according to this embodiment, in aplan view of module board 91 (viewed from the z-axis direction),conductive members mounted on principal surface 91 a are disposedbetween (i) inductors 31L and 32L and (ii) inductors 41L and 42L. Eachconductive member here is an electronic member having a conductivemember such as a signal extraction electrode. For example, theconductive member may be at least any of passive elements such as aresistor element, a capacitive element, an inductive element, a filter,a switch, a signal wire, and a signal terminal, and active elements suchas an amplifier and a control circuit. In this embodiment, theconductive member is at least any of duplexers 61 to 64. Further, theconductive member may be at least any of the transmission filters andthe reception filters in duplexers 61 to 64. The transmission filtersand the reception filters in duplexers 61 to 64 each have conductivemembers such as signal extraction electrodes. For example, at least oneof the signal extraction electrodes is connected to ground pattern 93Gdisposed in module board 91.

According to the above configuration, while transmission output matchingcircuit 30 and reception input matching circuit 40 are disposed onprincipal surface 91 a of module board 91, at least one of duplexers 61to 64 mounted on principal surface 91 a is disposed between (i)inductors 31L and 32L and (ii) inductors 41L and 42L. At least one ofduplexers 61 to 64 can thus block electromagnetic fields generated byinductors 31L and 32L and inductors 41L and 42L to preventelectromagnetic field coupling between (i) inductors 31L and 32L and(ii) inductors 41L and 42L. This can reduce harmonic components of ahigh-power radio frequency transmission signal amplified by transmissionpower amplifiers 11 and 12, or intermodulation distortion componentsbetween this radio frequency transmission signal and another radiofrequency signal, flowing into the reception circuit. Deterioration ofthe reception sensitivity of radio frequency module 1 can therefore beprevented.

It should be noted that “a conductive member mounted on principalsurface 91 a is disposed between (i) inductors 31L and 32L and (ii)inductors 41L and 42L in a plan view of module board 91” holds for atleast any one of the cases: (1) at least part of the region of theconductive member projected on the plan view overlaps a line connectingany point in the region of inductor 31L projected on the plan view andany point in the region of inductor 41L projected on the plan view, (2)at least part of the region of the conductive member projected on theplan view overlaps a line connecting any point in the region of inductor32L projected on the plan view and any point in the region of inductor41L projected on the plan view, (3) at least part of the region of theconductive member projected on the plan view overlaps a line connectingany point in the region of inductor 31L projected on the plan view andany point in the region of inductor 42L projected on the plan view, and(4) at least part of the region of the conductive member projected onthe plan view overlaps a line connecting any point in the region ofinductor 32L projected on the plan view and any point in the region ofinductor 42L projected on the plan view.

That is, although radio frequency module 1 according to this embodimenthas a configuration in which conductive members mounted on principalsurface 91 a are disposed between (i) inductors 31L and 32L and (ii)inductors 41L and 42L, the conductive members mounted on principalsurface 91 a may be disposed between at least one of inductors 31L and32L and at least one of inductors 41L and 42L. This can reduce harmoniccomponents of a high-power radio frequency transmission signaltransferred through a transmission path, or intermodulation distortioncomponents between this radio frequency transmission signal and anotherradio frequency signal, flowing into a reception path. Deterioration ofthe reception sensitivity in the reception path can therefore beprevented. Consequently, deterioration of the reception sensitivity ofradio frequency module 1 can be prevented.

1.3 Circuit Element Arrangement Configuration of Radio Frequency Module1A According to Variation

FIG. 3A is a schematic diagram illustrating a plan view configuration ofradio frequency module 1A according to a variation of Embodiment 1. FIG.3B is a schematic diagram illustrating a cross-sectional configurationof radio frequency module 1A according to the variation of Embodiment 1,and is specifically a cross-sectional view along line IIIB-IIIB in FIG.3A.

Radio frequency module 1A according to this variation is different fromradio frequency module 1 according to Embodiment 1 only in that metalchips 95 are additionally disposed. Hereinafter, radio frequency module1A according to this variation will be described mainly for points thatare different from radio frequency module 1 according to Embodiment 1,while points that are the same will not be described.

In radio frequency module 1A according to this variation, in a plan viewof module board 91 (viewed from the z-axis direction), metal chips 95mounted on principal surface 91 a are disposed between (i) inductors 31Land 32L and (ii) inductors 41L and 42L. That is, in this variation,metal chips 95 are disposed as conductive members disposed between (i)inductors 31L and 32L and (ii) inductors 41L and 42L. As illustrated inFIG. 3B, each of the metal chips is connected to ground pattern 93Gdisposed in module board 91.

Metal chips 95 are desirably higher than inductors 31L and 41L in thez-axis direction.

According to the above configuration, metal chips 95 can blockelectromagnetic fields generated by inductors 31L and 321_ and inductors41L and 42L to prevent electromagnetic field coupling between (i)inductors 31L and 32L and (ii) inductors 41L and 42L. This can reduceharmonic components of a high-power radio frequency transmission signalamplified by transmission power amplifiers 11 and 12, or intermodulationdistortion components between this radio frequency transmission signaland another radio frequency signal, flowing into the reception circuit.Deterioration of the reception sensitivity of radio frequency module 1Acan therefore be prevented.

It should be noted that, although duplexers 61 to 64 are disposedbetween (i) inductors 31L and 32L and (ii) inductors 41L and 42L inaddition to metal chips 95 mounted on principal surface 91 a in thisvariation, duplexers 61 to 64 need not be disposed between (i) inductors31L and 32L and (ii) inductors 41L and 42L in this variation. This isbecause metal chips 95 have the function of blocking electromagneticfields generated by inductors 31L, 32L, 41L, and 42L.

This embodiment and its variation have illustrated the transmissionfilters, the reception filters, and the metal chips as conductivemembers disposed between (i) inductors 31L and 32L and (ii) inductors41L and 42L. In addition to or instead of the transmission filters, thereception filters, and the metal chips, the conductive members may alsobe any of (1) switch 55, (2) switch 51 or 52, (3) switch 53 or 54, (4) adiplexer (a multiplexer) disposed between (i) common terminal 100 and(ii) the transmission filters and the reception filters, (5) a chipcapacitor, and (6) a control circuit that generates at least one of acontrol signal for adjusting the gains of transmission power amplifiers11 and 12 and reception low-noise amplifiers 21 and 22 and a controlsignal for controlling the switching of switches 51 to 56.

The control circuit in above (6) may be a switch IC that includes atleast one of switches 51 to 56.

The circuit elements in above (1) to (6) desirably have an electrode setto a ground potential or a fixed potential. For example, the circuitelements in above (1) to (6) are desirably connected to a ground patternformed in module board 91. This improves the electromagnetic fieldblocking function of the circuit elements in above (1) to (6).

With the conductive members illustrated above, electromagnetic fieldsgenerated by inductors 31L and 32L and inductors 41L and 42L can beblocked to prevent electromagnetic field coupling between (i) inductors31L and 32L and (ii) inductors 41L and 42L. This can reduce harmoniccomponents of a high-power radio frequency transmission signal amplifiedby transmission power amplifiers 11 and 12, or intermodulationdistortion components between this radio frequency transmission signaland another radio frequency signal, flowing into the reception circuit.Deterioration of the reception sensitivity of the radio frequency modulecan therefore be prevented.

Magnetic fluxes generated by inductors 31L and 32L may be orthogonal tomagnetic fluxes generated by inductors 41L and 42L. Specifically, forexample, the winding axes of coils that constitute inductors 31L and 32Lmay be orthogonal to the winding axes of coils that constitute inductors411_ and 42L. This can prevent interaction between (i) magnetic fieldsdefined by inductors 31L and 32L and (ii) magnetic fields defined byinductors 41L and 42L, Consequently, electromagnetic field couplingbetween (i) inductors 31L and 321_ and (ii) inductors 41L and 42L can beprevented to further prevent a reduction in the reception sensitivity ofthe radio frequency module.

1.4 Spaced-Apart Arrangement of First Inductance Element and SecondInductance Element

In radio frequency module 1 according to this embodiment, the conductivemembers mounted on module board 91 are disposed between (i) inductors31L and 32L and (H) inductors 41L and 42L. Alternatively, radiofrequency module 1 according to this embodiment may have a configurationas follows.

FIG. 4 is a diagram for describing a spaced-apart arrangement ofinductors 31L and 41L according to Embodiment 1, This figure shows onlyinductor 31L of matching circuit 31 and inductor 41L of matching circuit41, among transmission power amplifiers 11 and 12, reception low-noiseamplifiers 21 and 22, duplexers 61 to 64, matching circuits 31, 32, 41,and 42, and switches 51, 52, and 55 mounted on principal surface 91 a ofmodule board 91.

In a plan view of principal surface 91 a, principal surface 91 a isrectangular and has central region C that includes at least one oftransmission filters 61T to 64T and reception filters 61R to 64R, andperipheral region P that excludes central region C, Peripheral region Pfurther has four outer side regions PU (not illustrated in FIG. 4), PD(not illustrated in FIG. 4), PL, and PR that include four outer sides U,D, L, and R, respectively, of principal surface 91 a. Here, in a planview of principal surface 91 a, at least one of inductors 31L and 32Land at least one of inductors 41L and 42L are disposed in two outer sideregions PL and PR, respectively, located on opposite sides of centralregion C, or in two outer side regions PU and PD, respectively, locatedon opposite sides of central region C.

According to the above configuration, inductors 31L and 32L andinductors 41L and 42L are distributed on principal surface 91 a ofmodule board 91 in outer side regions located on opposite sides ofcentral region C that includes at least any one of the transmissionfilters and the reception filters. Inductors 31L and 32L and inductors41L and 42L disposed on principal surface 91 a of module board 91 arethus spaced apart from each other, so that it is possible to reduce theextent to which electromagnetic fields generated by inductors 31L and32L reach inductors 41L and 42L. This can reduce harmonic components ofa high-power radio frequency transmission signal amplified bytransmission power amplifiers 11 and 12, or intermodulation distortioncomponents between this radio frequency transmission signal and anotherradio frequency signal, flowing into the reception circuit.Deterioration of the reception sensitivity of radio frequency module 1can therefore be prevented.

1.5 Summary of Embodiment 1

As above, radio frequency module 1 according to this embodimentincludes: module board 91 that includes principal surface 91 a andprincipal surface 91 b on opposite sides of module board 91;transmission power amplifier 11 that amplifies a radio frequencytransmission signal; transmission output matching circuit 30 connectedto an output terminal of transmission power amplifier 11; receptionlow-noise amplifier 21 that amplifies a radio frequency receptionsignal; and reception input matching circuit 40 connected to an inputterminal of reception low-noise amplifier 21. Transmission outputmatching circuit 30 includes inductor 311 mounted on principal surface91 a, and reception input matching circuit 40 includes inductor 41Lmounted on principal surface 91 a. Here, in a plan view of module board91 (viewed from the z-axis direction), a conductive member mounted onprincipal surface 91 a is disposed between inductor 31L and inductor41L.

Consequently, for example, the conductive member can blockelectromagnetic fields generated by inductors 31L and 41L even if thefrequency of intermodulation distortion between a radio frequencytransmission signal of communication band A amplified by transmissionpower amplifier 11 and another radio frequency signal overlaps part ofthe reception band of communication band A. This can preventelectromagnetic field coupling between inductor 31L and inductor 41L,thereby preventing the intermodulation distortion from bypassingtransmission filter 61T and flowing into the reception path forcommunication band A, Deterioration of the reception sensitivity ofradio frequency module 1 can therefore be prevented.

Radio frequency module 1 according to this embodiment includes: commonterminal 100; a first transmission circuit and a second receptioncircuit that transmit and receive, to and from common terminal 100,radio frequency signals of communication band A belonging to a firstfrequency band group; a second transmission circuit and a firstreception circuit that transmit and receive, to and from common terminal100, radio frequency signals of communication band C belonging to asecond frequency band group covering frequencies higher than frequenciesof the first frequency band group; and module board 91 on which thefirst and second transmission circuits and the first and secondreception circuits are mounted. The first transmission circuit includes:transmission power amplifier 11 (a first transmission power amplifier);transmission filter 61T (a first transmission filter) that is disposedin transmission path AT connecting transmission power amplifier 11 andcommon terminal 100 and has, as a passband, the transmission band ofcommunication band A; and transmission output matching circuit 30 thatis mounted on principal surface 91 a, is disposed in transmission pathAT between transmission power amplifier 11 and transmission filter 61T,and matches the impedances of transmission power amplifier 11 andtransmission filter 61T. The second reception circuit includes:reception low-noise amplifier 21 (a second reception low-noiseamplifier); and reception filter 61R (a second reception filter) that isdisposed in transmission path AR connecting reception low-noiseamplifier 21 and common terminal 100 and has, as a passband, thereception band of communication band A. The second transmission circuitincludes: transmission power amplifier 12; and transmission filter 63T(a second transmission filter) that is disposed in transmission path CTconnecting transmission power amplifier 12 and common terminal 100 andhas, as a passband, the transmission band of communication band C. Thefirst reception circuit includes: reception low-noise amplifier 22 (afirst reception low-noise amplifier); reception filter 63R (a firstreception filter) that is disposed in reception path CR connectingreception low-noise amplifier 22 and common terminal 100 and has, as apassband, the reception band of communication band C; and receptioninput matching circuit 40 that is mounted on principal surface 91 a, isdisposed in reception path CR between reception low-noise amplifier 21and reception filter 63R, and matches the impedances of receptionlow-noise amplifier 21 and reception filter 63R. Transmission outputmatching circuit 30 includes inductor 31L, and the reception inputmatching circuit includes inductor 42L. Here, in a plan view of moduleboard 91, a conductive member mounted on principal surface 91 a may bedisposed between inductor 31L and inductor 42L.

Consequently, for example, the conductive member can blockelectromagnetic fields generated by inductors 31L and 42L even if thefrequency of a harmonic of a radio frequency transmission signal ofcommunication band A amplified by transmission power amplifier 11, orthe frequency of intermodulation distortion between this radio frequencytransmission signal and another radio frequency signal, overlaps part ofthe reception band of communication band C. This can preventelectromagnetic field coupling between inductor 31L and inductor 42L,thereby preventing the intermodulation distortion components frombypassing transmission filter 61T and flowing into the reception pathfor communication band C. Deterioration of the reception sensitivity ofradio frequency module 1 can therefore be prevented.

Radio frequency module 1 according to this embodiment includes commonterminal 100, a first transmission circuit, a first reception circuit,and module board 91. The first transmission circuit includes:transmission power amplifier 11 (a first transmission power amplifier);transmission filter 611 (a first transmission filter) that is disposedin a transmission path connecting transmission power amplifier 11 andcommon terminal 100 and passes radio frequency transmission signals ofthe transmission band of communication band A; and transmission outputmatching circuit 30 that is mounted on principal surface 91 a, isdisposed in a transmission path between transmission power amplifier 11and transmission filter 61T, and matches the impedances of transmissionpower amplifier 11 and transmission filter 61T. The first receptioncircuit includes: reception low-noise amplifier 21 (a first receptionlow-noise amplifier); reception filter 61R (a first reception filter)that is disposed in a reception path connecting reception low-noiseamplifier 21 and common terminal 100 and passes radio frequencyreception signals of the reception band of communication band A; andreception input matching circuit 40 that is mounted on principal surface91 a, is disposed in a reception path between reception low-noiseamplifier 21 and reception filter 61R, and matches the impedances ofreception low-noise amplifier 21 and reception filter 61R, Transmissionoutput matching circuit 30 includes inductor 31L, and the receptioninput matching circuit includes inductor 41L, Here, in a plan view ofprincipal surface 91 a, principal surface 91 a includes: central regionC including at least one of the transmission filter and the receptionfilter; and four outer side regions Ply, PD, PL, and PR excludingcentral region C and including respective four outer sides ofrectangular principal surface 91 a, In a plan view of principal surface91 a, inductor 31L and inductor 41L may each be disposed in a differentone of two outer side regions located on opposite sides of centralregion C.

Inductor 31L and inductor 41L disposed on principal surface 91 a ofmodule board 91 are thus spaced apart from each other, so that it ispossible to reduce the extent to which an electromagnetic fieldgenerated by inductor 31L reaches inductor 41L. This can reduce harmoniccomponents of a high-power radio frequency transmission signal amplifiedby transmission power amplifier 11, or intermodulation distortioncomponents between this radio frequency transmission signal and anotherradio frequency signal, flowing into the reception circuit.Deterioration of the reception sensitivity of radio frequency module 1can therefore be prevented.

Embodiment 2

Embodiment 1 has illustrated what is called a single-sided mountingconfiguration, in which the circuit elements of the radio frequencymodule are mounted on principal surface 91 a of module board 91. Anembodiment below illustrates what is called a double-sided mountingconfiguration, in which the circuit elements of the radio frequencymodule are mounted on principal surfaces 91 a and 91 b of module board91. It should be noted that the circuit configuration of radio frequencymodule 1B according to this embodiment is the same as that of radiofrequency module 1 according to Embodiment 1 illustrated in FIG. 1 andtherefore will not be described.

2.1 Circuit Element Arrangement Configuration of Radio Frequency Module1B

FIG. 5A is a schematic diagram illustrating a plan view configuration ofradio frequency module 18 according to Embodiment 2. FIG. 5B is aschematic diagram illustrating a cross-sectional configuration of radiofrequency module 16 according to Embodiment 2, and is specifically across-sectional view along line VB-VB in FIG. 5A. It should be notedthat (a) in FIG. 5A illustrates a view of the arrangement of circuitelements on principal surface 91 a of principal surfaces 91 a and 91 bon the opposite sides of module board 91, viewed from the y-axispositive direction-side, By contrast, (b) in FIG. 5A illustrates asee-through view of the arrangement of circuit elements on principalsurface 91 b viewed from the y-axis positive direction-side.

As illustrated in FIGS. 5A and 5B, radio frequency module 1B accordingto this embodiment further includes module board 91 and resin members 92and 93, in addition to the circuit configuration illustrated in FIG. 1.Radio frequency module 16 according to this embodiment is different fromradio frequency module 1 according to Embodiment 1 in that the circuitelements of radio frequency module 1B are mounted on both sides ofmodule board 91. Hereinafter, radio frequency module 1B according tothis embodiment will be described mainly for points that are differentfrom radio frequency module 1 according to Embodiment 1, while pointsthat are the same will not be described.

As illustrated in FIGS. 5A and 58, in radio frequency module 13according to this embodiment, transmission power amplifiers 11 and 12,duplexers 61 to 64, and matching circuits 31, 32, 41, and 42 aresurface-mounted on principal surface 91 a of module board 91. On theother hand, reception low-noise amplifiers 21 and 22 and switches 51,52, and 55 are surface-mounted on principal surface 91 b of module board91.

Here, in radio frequency module 1B according to this embodiment, in aplan view of module board 91 (viewed from the z-axis direction),conductive members mounted on principal surface 91 a are disposedbetween (i) inductors 31L and 32L and (ii) inductors 41L and 42L. Inthis embodiment, the conductive members are at least any of duplexers 61to 64. Further, the conductive members may be at least any of thetransmission filters and reception filters in duplexers 61 to 64. Thetransmission filters and reception filters in duplexers 61 to 64 eachhave conductive members such as signal extraction electrodes. Forexample, at least one of the signal extraction electrodes is connectedto ground pattern 93G disposed in module board 91.

According to the above configuration, while transmission output matchingcircuit 30 and reception input matching circuit 40 are disposed onprincipal surface 91 a of module board 91, at least one of duplexers 61to 64 mounted on principal surface 91 a is disposed between (i)inductors 31L and 32L and (ii) inductors 41L and 42L. At least one ofduplexers 61 to 64 can thus block electromagnetic fields generated byinductors 31L and 32L and inductors 41L and 42L to preventelectromagnetic field coupling between (i) inductors 31L and 32L and(ii) inductors 41L and 42L. This can reduce harmonic components of ahigh-power radio frequency transmission signal amplified by transmissionpower amplifiers 11 and 12, or intermodulation distortion componentsbetween this radio frequency transmission signal and another radiofrequency signal, flowing into the reception circuit. Deterioration ofthe reception sensitivity of radio frequency module 1B can therefore beprevented.

It should be noted that, although radio frequency module 1B according tothis embodiment has a configuration in which conductive members mountedon principal surface 91 a are disposed between (i) inductors 31L and 32Land (ii) inductors 41L and 42L, the conductive members mounted onprincipal surface 91 a may be disposed between at least one of inductors31L and 32L and at least one of inductors 41L and 42L. This can reduceharmonic components of a high-power radio frequency transmission signaltransferred through a transmission path, or intermodulation distortioncomponents between this radio frequency transmission signal and anotherradio frequency signal, flowing into a reception path, Deterioration ofthe reception sensitivity in the reception path can therefore beprevented. Consequently, deterioration of the reception sensitivity ofradio frequency module 18 can be prevented.

In this embodiment, transmission power amplifiers 11 and 12 are mountedon principal surface 91 a, and reception low-noise amplifiers 21 and 22are mounted on principal surface 91 b. Module board 91 is thusinterposed between (i) transmission power amplifiers 11 and 12 and (ii)reception low-noise amplifiers 21 and 22, so that radio frequencytransmission signals output from transmission power amplifiers 11 and 12can be prevented from directly flowing into reception low-noiseamplifiers 21 and 22. This improves the isolation between thetransmission circuit and the reception circuit.

In radio frequency module 1B according to this embodiment, columnarelectrodes 150 are disposed on principal surface 91 b of module board91, Radio frequency module 1B exchanges, via columnar electrodes 150,electric signals with a mounting board disposed on the z-axis negativedirection-side of radio frequency module 1B. Some of columnar electrodes150 are set to the ground potential of the mounting board. Of principalsurfaces 91 a and 91 b, principal surface 91 b facing the mounting boardincludes reception low-noise amplifiers 21 and 22 and switches 51, 52,and 55, which are easily reduced in profile, but does not includetransmission power amplifiers 11 and 12, which are not easily reduced inprofile. This enables the profile of entire radio frequency module 1B tobe reduced, Columnar electrodes 150 applied as ground electrodes aredisposed around reception low-noise amplifiers 21 and 22 thatsignificantly affect the reception sensitivity of the reception circuit,so that deterioration of the reception sensitivity of the receptioncircuit can be prevented.

2.2 Circuit Element Arrangement Configuration of Radio Frequency Module1C According to Variation

FIG. 6 is a schematic diagram illustrating a cross-sectionalconfiguration of radio frequency module 1C according to Variation 1 ofEmbodiment 2.

Radio frequency module 1C according to this variation is different fromradio frequency module 1B according to Embodiment 2 only in that chipcapacitors 85 and 86 and shield electrode layer 96 are additionallydisposed. Hereinafter, radio frequency module 1C according to thisvariation will be described mainly for points that are different fromradio frequency module 1B according to Embodiment 2, while points thatare the same will not be described.

In radio frequency module 1C according to this variation, in a plan viewof module board 91 (viewed from the z-axis direction), conductivemembers mounted on principal surface 91 a are disposed between inductor31L and inductor 41L. In this variation, the conductive members are chipcapacitor 85 and duplexers 61 to 64.

Shield electrode layer 96 is formed to cover the top and sides of resinmember 92 and the sides of resin member 93. Shield electrode layer 96 isconnected, on a side of module board 91, to ground pattern 94G in moduleboard 91 set to the ground potential. Providing shield electrode layer96 can prevent transmission signals from transmission power amplifiers11 and 12 from being directly emitted outside radio frequency module 1C,and also prevent external noise from being introduced into the circuitelements of radio frequency module 1C. Further, heat-releasingperformance is improved because heat generated by transmission poweramplifiers 11 and 12 can be released through shield electrode layer 96.

As illustrated in FIG. 6, chip capacitor 85 is oriented such that a lineconnecting two input-output electrodes is perpendicular to principalsurface 91 a; one input-output electrode may be connected to principalsurface 91 a while the other input-output electrode may be connected toshield electrode layer 96. The main body of chip capacitor 85 betweenthe two input-output electrodes may be covered by a shielding conductivefilm. Chip capacitor 85 may be any chip capacitor included in radiofrequency module 1C. For example, chip capacitor 85 may be capacitor 31Cin matching circuit 31, or capacitor 41C in matching circuit 41.

As illustrated in FIG. 6, chip capacitor 86 is oriented such that a lineconnecting two input-output electrodes is parallel to principal surface91 a; the two input-output electrodes are connected to principal surface91 b. The main body of chip capacitor 86 between the two input-outputelectrodes may be covered by a shielding conductive film. Chip capacitor86 may be any chip capacitor included in radio frequency module 1C. Forexample, chip capacitor 86 may be capacitor 32C in matching circuit 32,or capacitor 42C in matching circuit 42.

According to the above configuration, while transmission output matchingcircuit 30 and reception input matching circuit 40 are disposed onprincipal surface 91 a of module board 91, chip capacitor 85 mounted onprincipal surface 91 a is disposed between inductor 31L and inductor41L. Chip capacitor 85 can thus block electromagnetic fields generatedby inductor 31L and inductor 41L to prevent electromagnetic fieldcoupling between inductor 31L and inductor 41L. This can reduce harmoniccomponents of a high-power radio frequency transmission signal amplifiedby transmission power amplifier 11, or intermodulation distortioncomponents between this radio frequency transmission signal and anotherradio frequency signal, flowing into the reception circuit.Deterioration of the reception sensitivity of radio frequency module 1Ccan therefore be prevented.

In a plan view of module board 91, a chip capacitor mounted on principalsurface 91 a may be disposed on principal surface 91 a between inductor32L and inductor 42L. The chip capacitor can thus block electromagneticfields generated by inductor 32L and inductor 42L to preventelectromagnetic field coupling between inductor 32L and inductor 42L.This can reduce harmonic components of a high-power radio frequencytransmission signal amplified by transmission power amplifier 12, orintermodulation distortion components between this radio frequencytransmission signal and another radio frequency signal, flowing into thereception circuit, Deterioration of the reception sensitivity of radiofrequency module 1C can therefore be prevented.

2.3 Circuit Element Arrangement Configuration of Radio Frequency Module1D

FIG. 7A is a schematic diagram illustrating a plan view configuration ofradio frequency module 1D according to Variation 2 of Embodiment 2. FIG.78 is a schematic diagram illustrating a cross-sectional configurationof radio frequency module 1D according to Variation 2 of Embodiment 2,and is specifically a cross-sectional view along line VIIB-VIIB in FIG.7A. It should be noted that (a) in FIG. 7A illustrates a view of thearrangement of circuit elements on principal surface 91 a of principalsurfaces 91 a and 91 b on the opposite sides of module board 91, viewedfrom the y-axis positive direction-side. By contrast, (b) in FIG. 7Aillustrates a see-through view of the arrangement of circuit elements onprincipal surface 91 b viewed from the y-axis positive direction-side.

As illustrated in FIGS. 7A and 78, radio frequency module 1D accordingto this variation further includes module board 91, resin members 92 and93, and metal chips 95 a and 95 b, in addition to the circuitconfiguration illustrated in FIG. 1. Radio frequency module 1D accordingto this variation is different from radio frequency module 1B accordingto Embodiment 2 in that metal chips 95 a and 95 b are additionallydisposed, and in how the circuit elements of radio frequency module 1Dare divided between principal surfaces 91 a and 91 b, Hereinafter, radiofrequency module 1D according to this variation will be described mainlyfor points that are different from radio frequency module 1B accordingto Embodiment 2, while points that are the same will not be described.

As illustrated in FIGS. 7A and 78, in radio frequency module 1Daccording to this variation, transmission power amplifier 11, receptionlow-noise amplifier 21, duplexers 61 and 62, matching circuits 31 and41, switch 55, and metal chips 95 a are surface-mounted on principalsurface 91 a of module board 91, On the other hand, transmission poweramplifier 12, reception low-noise amplifier 22, duplexers 63 and 64,matching circuits 32 and 42, switches 51 and 52, and metal chips 95 bare surface-mounted on principal surface 91 b of module board 91.

That is, in radio frequency module 1D according to this variation,principal surface 91 a has mounted thereon the first transmissioncircuit including transmission path AT for communication band A andtransmission path BT for communication band B, and the first receptioncircuit including reception path AR for communication band A andreception path BR for communication band B. On the other hand, principalsurface 91 b has mounted thereon the second transmission circuitincluding transmission path CT for communication band C and transmissionpath DT for communication band D, and the second reception circuitincluding reception path CR for communication band C and reception pathDR for communication band D.

Here, in radio frequency module 1D according to this variation, in aplan view of module board 91 (viewed from the z-axis direction),conductive members mounted on principal surface 91 a are disposedbetween inductor 31L and inductor 41L, and conductive members mounted onprincipal surface 91 b are disposed between inductor 32L and inductor42L. In this embodiment, the conductive members are metal chips 95 a and95 b.

As illustrated in FIG. 7B, each of metal chips 95 a is connected toground pattern 93G1 disposed in module board 91, and each of metal chips95 b is connected to ground pattern 93G2 disposed in module board 91.

According to the above configuration, metal chips 95 a can blockelectromagnetic fields generated by inductor 31L and inductor 41L, andmetal chips 95 b can block electromagnetic fields generated by inductor32L and inductor 42L. Therefore, electromagnetic field coupling betweeninductor 31L and inductor 41L and electromagnetic field coupling betweeninductor 32L and inductor 42L can be prevented. This can reduce harmoniccomponents of a high-power radio frequency transmission signal amplifiedby transmission power amplifiers 11 and 12, or intermodulationdistortion components of this radio frequency transmission signal andanother radio frequency signal, flowing into the reception circuits.Deterioration of the reception sensitivity of radio frequency module 1Dcan therefore be prevented.

It should be noted that, although duplexers 61 and 62 are disposedbetween inductor 31L and inductor 41L in addition to metal chips 95 amounted on principal surface 91 a in this variation, duplexers 61 and 62need not be disposed between inductor 31L and inductor 41L in thisvariation. It should also be noted that, although duplexers 63 and 64are disposed between inductor 32L and inductor 42L in addition to metalchips 95 b mounted on principal surface 91 b, duplexers 63 and 64 neednot be disposed between inductor 32L and inductor 42L in this variation.This is because metal chips 95 a have the function of blockingelectromagnetic fields generated by inductors 31L and 41L, and metalchips 95 b have the function of blocking electromagnetic fieldsgenerated by inductors 32L and 42L.

In radio frequency module 1D according to this variation, the firsttransmission and reception circuits that propagate radio frequencysignals of the first frequency band group and the second transmissionand reception circuits that propagate radio frequency signals of thesecond frequency band group are mounted on the opposite sides of moduleboard 91, Consequently, in performing CA of a radio frequency signal ofthe first frequency band group and a radio frequency signal of thesecond frequency band group, module board 91 can reduce mutualinterference between the two radio frequency signals. This improves theisolation between the first transmission and reception circuits and thesecond transmission and reception circuits.

Although this embodiment and the variations thereof have illustrated theduplexers, chip capacitors, and the metal chips as conductive membersdisposed between (i) inductors 31L and 32L and (ii) inductors 41L and42L, the conductive members may also be any of (1) switch 55, (2) switch51 or 52, (3) switch 53 or 54, (4) a diplexer (multiplexer) disposedbetween (i) common terminal 100 and (ii) the transmission filters andthe reception filters, and (5) a control circuit that generates at leastone of a control signal for adjusting the gains of transmission poweramplifiers 11 and 12 and reception low-noise amplifiers 21 and 22, and acontrol signal for controlling the switching of switches 51 to 56.

The control circuit in above (5) may be a switch IC that includes atleast one of switches 51 to 56.

The circuit elements in above (1) to (5) desirably have an electrode setto a ground potential or a fixed potential. For example, the circuitelements in above (1) to (5) are desirably connected to a ground patternformed in module board 91. This improves the electromagnetic fieldblocking function of the circuit elements in above (1) to (5).

With the conductive members illustrated above, electromagnetic fieldsgenerated by inductors 31L and 32L and inductors 41L and 42L can beblocked to prevent electromagnetic field coupling between (i) inductors31L and 32L and (ii) inductors 41L and 42L. This can reduce harmoniccomponents of a high-power radio frequency transmission signal amplifiedby transmission power amplifier 11 and 12, or intermodulation distortioncomponents of this radio frequency transmission signal and another radiofrequency signal, flowing into the reception circuits. Deterioration ofthe reception sensitivity of the radio frequency module can therefore beprevented.

The radio frequency module according to this embodiment and thevariations thereof have the conductive members mounted on module board91 between (i) inductors 31L and 32L and (ii) inductors 41L and 42L.Alternatively, the radio frequency modifies according to this embodimentand the variations thereof may have the following configuration.

That is, as illustrated in FIG. 4 presented in Embodiment 1, in a planview of module board 91, principal surfaces 91 a and 91 b arerectangular, and one of principal surfaces 91 a and 91 b with at leastone of matching circuits 31, 32, 41, and 42 has central region C thatincludes at least one of transmission filters 61T to 64T and receptionfilters 61R to 64R, and peripheral region P that excludes central regionC. Peripheral region P further has four outer side regions PU, PD, PL,and PR that include four outer sides U, D, L, and R, respectively, ofthe principal surface. Here, in a plan view of module board 91, at leastone of inductors 31L and 32L and at least one of inductors 41L and 42Lare disposed in two outer side regions PL and PR, respectively, locatedon opposite sides of central region C, or in two outer side regions PUand PD, respectively, located on opposite sides of central region C.

According to the above configuration, inductors 31L and 32L andinductors 41L and 42L are distributed in outer side regions located onopposite sides of central region C that includes at least any of thetransmission filters and the reception filters. Inductors 31L and 32Land inductors 41L and 42L are thus spaced apart from each other in aplan view of module board 91, so that it is possible to reduce theextent to which electromagnetic fields generated by inductors 31L and32L reach inductors 41L and 42L. This can reduce harmonic components ofa high-power radio frequency transmission signal amplified bytransmission power amplifier 11 and 12, or intermodulation distortioncomponents of this radio frequency transmission signal and another radiofrequency signal, flowing into the reception circuits, Deterioration ofthe reception sensitivity of the radio frequency module according tothis embodiment and the variations thereof can therefore be prevented.

OTHER EMBODIMENTS

Although radio frequency modules and communication devices according tothe present disclosure have been described above based on exemplaryembodiments and variations thereof, the radio frequency circuit andcommunication device according to the present disclosure are not limitedto the foregoing embodiments and variations. The present disclosure alsoencompasses other embodiments achieved by combining arbitrary elementsin the above embodiments and variations thereof, variations resultingfrom various modifications to the embodiments and variations thereofthat may be conceived by those skilled in the art without departing fromthe essence of the present disclosure, and various devices that includethe radio frequency module and communication device according to thepresent disclosure.

For example, in the radio frequency modules and communication devicesaccording to the foregoing exemplary embodiments and variations thereof,another circuit element and line may be inserted in a path connectingrespective circuit elements and signal paths disclosed in the drawings

INDUSTRIAL APPLICABILITY

The present disclosure can be widely used in communication apparatusessuch as a mobile phone, as a radio frequency module provided in amultiband-compatible front-end unit.

1. A radio frequency module, comprising: a module board including afirst principal surface and a second principal surface on opposite sidesof the module board; a first transmission power amplifier configured toamplify a radio frequency transmission signal; a transmission outputmatching circuit connected to an output terminal of the firsttransmission power amplifier; a first reception low-noise amplifierconfigured to amplify a radio frequency reception signal; and areception input matching circuit connected to an input terminal of thefirst reception low-noise amplifier, wherein the transmission outputmatching circuit includes a first inductance element mounted on thefirst principal surface, the reception input matching circuit includes asecond inductance element mounted on the first principal surface, and ina plan view of the module board, a conductive member mounted on thefirst principal surface is disposed between the first inductance elementand the second inductance element.
 2. The radio frequency moduleaccording to claim 1, further comprising: a common terminal; a firsttransmission filter disposed in a transmission path connecting the firsttransmission power amplifier and the common terminal, and configured topass a radio frequency transmission signal of a predeterminedtransmission band out of the radio frequency transmission signalamplified by the first transmission power amplifier; and a firstreception filter disposed in a reception path connecting the firstreception low-noise amplifier and the common terminal, and configured topass a radio frequency reception signal of a predetermined receptionband out of a radio frequency reception signal input from the commonterminal, wherein the transmission output matching circuit is disposedin the transmission path between the first transmission power amplifierand the first transmission filter, and is configured to match impedancesof the first transmission power amplifier and the first transmissionfilter, and the reception input matching circuit is disposed in thereception path between the first reception low-noise amplifier and thefirst reception filter, and is configured to match impedances of thefirst reception low-noise amplifier and the first reception filter. 3.The radio frequency module according to claim 2, wherein the conductivemember is any one of: (1) a first switch configured to switch betweenconduction and non-conduction between the transmission path and thecommon terminal and conduction and non-conduction between the receptionpath and the common terminal; (2) a second switch configured to switchconduction and non-conduction between the transmission path and thefirst transmission power amplifier; (3) a third switch configured toswitch conduction and non-conduction between the reception path and thefirst reception low-noise amplifier; (4) the first transmission filter;(5) the first reception filter; (6) a multiplexer disposed between (i)the common terminal and (ii) the first transmission filter and the firstreception filter; (7) a metal chip; (8) a chip capacitor; (9) a controlcircuit configured to generate at least one of a control signal foradjusting a gain of the first transmission power amplifier and a gain ofthe first reception low-noise amplifier or a control signal forcontrolling switching of the first switch, the second switch, and thethird switch.
 4. The radio frequency module according to claim 2,wherein the predetermined transmission band is a transmission band of afirst communication band, the predetermined reception band is areception band of the first communication band, the first transmissionpower amplifier is configured to preferentially amplify a radiofrequency transmission signal of the transmission band of the firstcommunication band, the first reception low-noise amplifier isconfigured to preferentially amplify a radio frequency reception signalof the reception band of the first communication band, the firsttransmission filter and the first reception filter constitute a duplexerthat supports the first communication band, and the conductive member isat least one of the first transmission filter or the first receptionfilter.
 5. The radio frequency module according to claim 2, wherein thepredetermined transmission band is a transmission band of a firstcommunication band, the predetermined reception band is a reception bandof a second communication band different from the first communicationband, the first transmission power amplifier is configured topreferentially amplify a radio frequency transmission signal of thetransmission band of the first communication band, the first receptionlow-noise amplifier is configured to preferentially amplify a radiofrequency reception signal of the reception band of the secondcommunication band, the radio frequency module further comprises: asecond transmission power amplifier configured to preferentially amplifya radio frequency transmission signal of a transmission band of thesecond communication band; a second transmission filter disposed in atransmission path connecting the second transmission power amplifier andthe common terminal, and configured to pass the radio frequencytransmission signal of the transmission band of the second communicationband out of a radio frequency transmission signal amplified by thesecond transmission power amplifier; a second reception low-noiseamplifier configured to preferentially amplify a radio frequencyreception signal of a reception band of the first communication band;and a second reception filter disposed in a reception path connectingthe second reception low-noise amplifier and the common terminal, andconfigured to pass the radio frequency reception signal of the receptionband of the first communication band out of a radio frequency receptionsignal input from the common terminal, and the conductive member is atleast one of the first transmission filter, the second transmissionfilter, the first reception filter, or the second reception filter. 6.The radio-frequency module according to claim 5, wherein transmission ofa radio frequency transmission signal of the first communication bandand reception of a radio frequency reception signal of the secondcommunication band are executed simultaneously.
 7. The radio-frequencymodule according to claim 2, wherein a frequency of a harmonic of theradio frequency transmission signal amplified by the first transmissionpower amplifier or a frequency of intermodulation distortion between theradio frequency transmission signal and another radio frequency signaloverlaps at least part of the predetermined reception band
 8. Theradio-frequency module according to claim 1, wherein the conductivemember includes an electrode that is grounded via the first principalsurface.
 9. The radio-frequency module according to claim 1, wherein inthe plan view of the module board, at least part of a region of theconductive member projected in the plan view overlaps a line connectingan arbitrary point in a region of the first inductance element projectedin the plan view and an arbitrary point in a region of the secondinductance element projected in the plan view.
 10. A radio-frequencymodule, comprising: a module board including a first principal surfaceand a second principal surface that are opposite each other, the firstprincipal surface being rectangular shaped; a first transmission poweramplifier configured to amplify a radio frequency transmission signal; afirst transmission filter disposed in a transmission path including thefirst transmission power amplifier; and configured to pass a radiofrequency transmission signal of a predetermined transmission band outof the radio frequency transmission signal amplified by the firsttransmission power amplifier; a transmission output matching circuitdisposed in the transmission path between the first transmission poweramplifier and the first transmission filter, and configured to matchimpedances of the first transmission power amplifier and the firsttransmission filter; a first reception low-noise amplifier configured toamplify a radio frequency reception signal; a first reception filterdisposed in a reception path including the first reception low-noiseamplifier, and configured to pass a radio frequency reception signal ofa predetermined reception band out of a radio frequency receptionsignal; and a reception input matching circuit disposed in the receptionpath between the first reception low-noise amplifier and the firstreception filter, and configured to match impedances of the firstreception low-noise amplifier and the first reception filter, whereinthe transmission output matching circuit includes a first inductanceelement mounted on the first principal surface, the reception inputmatching circuit includes a second inductance element mounted on thefirst principal surface, in the plan view of the first principalsurface, the first principal surface includes a central region and fourouter side regions including four outer sides of the first principalsurface other than the central region, the central region containing atleast one of the first transmission filter or the first receptionfilter, in the plan view of the first principal surface, the firstinductance element and the second inductance element are each disposedin a different one of two outer side regions out of the four outer sideregions, the two outer side regions being located on opposite sides ofthe central region.
 11. A communication device, comprising: an RF signalprocessing circuit configured to process a radio frequency signal whichis transmitted or received by an antenna element; and the radiofrequency module according to claim 1 configured to propagate the radiofrequency signal between the antenna element and the RF signalprocessing circuit.